Stryke Industries has recently filed IP relating to an electronics thermal management concept designed to maximize the performance of high-power electronics. This work is part of Stryke’s Advanced Materials technology area and works to effectively and efficiently remove heat to allow the processors and other integrated chips to operating at peak conditions. The title of the application is, “Thermally Enhanced Printed Circuit Board Architecture for High Power Electronics”. A concept paper on the technology can be found here.

To start a conversation with Stryke about the technology please Contact Us.

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